Wafer Inspection Systems

Wafer Inspection System is to detect defects of semiconductor circuit pattern or contamination on the surface of wafer in the IC fabrication. This system is essential for starting up of new products or process, yield improvement of mass production products and early detection or improvement of malfunction of processes or equipment.

Wafer Inspection Systems: WIN-WIN 50
The WIN-WIN 50 is based on state-of-the-art technology like our unique optics, a high speed image processing system and an extraordinarily precise wafer stage. Tokyo Seimitsu harmonizes this technology with our "Win-Win Relationship" spirit, the company's motto, to place the WIN-WIN 50 far ahead of existing products. The WIN-WIN 50 can handle wafers up to 300 mm.
Feature 1: Confocal microscope
A confocal microscope, developed in cooperation with Carl Zeiss of Germany, is incorporated into the system to enhance image resolution.
Feature 2: UV light source
A broad-band white source and a UV source are used for sensing. These sources enhance image resolution and cope with process changes.
Feature 3: CCD camera
Newly developed UV light compatible high speed and high sensitivity CCD camera.
Feature 4: Super-precision stage
The superbly precise stage, which boasts a straightness of 10nm, uses a laser length measurement system for accurate control.
Feature 5: Extraordinarily fast image processing
Parallel processing greatly accelerates image processing.
Feature 6: ADC engine
The WIN-WIN 50 is equipped with the online parallel ADC function that is able to dramatically reduce the ADC time.
- Online parallel ADC : By conducting ADC during inspection, the time required for ADC is greatly reduced.
Feature 7: Space saving
The main unit and the image processing unit are separate units and by connecting with optical fiber cables, the image processing unit can be set outside of the clean room. The lineup includes an even more compact model to handle 150/200 mm wafers.
Space saving

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