Wafer Dicing Machines

Wafer Dicing Machine is to separate chips created on wafer into individual chip. At present, separation by a blade mounted on the tip of spindle rotating with high speed is the mainstream. However, we have launched a Laser Dicing Machine which realizes complete dry process. In addition, Dicing Machine is also used for electrical components besides silicon wafers.

A-WD-300TX

The A-WD-300TX inherits the opposing-type spindle system developed by Accretech, incorporates a newly developed 80,000 rpm high-speed spindle, and features an X axis drive with a high movement speed of 1,000 mm per second. This has boosted productivity 1.3 times compared to the previous model, and provides an optimum level of reliability and performance, enabling this fully automatic dicing machine to handle the production of 300mm wafers.

Feature 1:: Triple air acceleration cleaning heads have reduced cleaning time by approximately 1/2 (industry first).
Feature 2:: Standard provision of water cleaning unit reduces contamination during dicing process (industry first).
Feature 3:: Wafer protection system incorporated on transport arm prevents wafer from being dropped in the unlikely event air supply is interrupted (industry first).

A-WD-300T

Load port type

A new face-to-face, twin-spindle arrangement and accelerated motion of the X-axis achieve greater throughput. Air bearings, ceramic guides and a linear motor on the X-axis are used to achieve a completely contact-free drive mechanism which enhances dicing quality by minimizing vibration. The new mechanism also enhances reliability and user friendly operation, a common feature found in all ACCRETECH's machines. This machine opens up a new world in wafer dicing operations.

Feature 1:: The full automatic wafer dicing machine for the 300 mm wafer.
Feature 2:: The linear motor is used at the X-axis driving unit, which attains less vibration and higher quality in process.
Feature 3:: The color LCD monitor and the touch panel for the easy operation.
Feature 4:: The X-axis is designed as maintenance-free, complete non-contact driving system.

A-WD-200T

Feature 1:: The linear motor is used at the X-axis driving unit, which attains less vibration and higher quality in process.
Feature 2:: The color LCD monitor and the touch panel for the easy operation.
Feature 3:: The X-axis is designed as maintenance-free, complete non-contact driving system.

A-WD-250S

High process through user-friendly operations.

Feature 1:: Production data management/ automatic machine condition data logging.
Feature 2:: The world's smallest fully-automatic wafer dicing machine.
Feature 3:: High accuracy, and high speed.
Feature 4:: Multi-function design and future system expandability.

A-WD-110A

High process quality through user-friendly operations.

Feature 1:: Incorporates image processing-type alignment function.

A-WD-100A

High process quality through user-friendly operations.

Feature 1:: Compact machine capable of dicing size up to 240 mm dia or 240?180 mm.

A-WD-10B

This multipurpose dicing machine realizes ease of use with the adaptation of the much sought-after space saving factor, slide cover system and function management system.

Feature 1:: The Z-axis drive unit encoder system stepping motor guarantees high accuracy and reliability, and the X- and Y- axis slide section has a high accuracy, high rigidity linear guide.
Feature 2:: Simultaneous 2-axis control of X- and Y-axis and high throughput, with a max. speed of X-axis: 450mm/s, Y-axis: 80mm/s and Z- axis: 40 mm/s.

HUB Blade

ACCRETECH's dicing technology for many years have been crystallized as hub blades for silicon wafer dicing. The EPH series is the dicing blade with the aluminum base electrocoated with the diamond power hardened by nickel bond.

Feature 1:: Well-balanced blade with high quality, long life and high productivity
Feature 2:: Many blade variations