Ultra Edge – 200, 300

Features and Benefits

Capable of grinding and (or) polishing 200 mm or 300 mm diameter wafers with a notch.
Rough and fine grinding of wafer diameter using one multi grit grind wheel.
Rough and fine grinding of “V” notch using two high-speed spindles.
Fine Tape Polish of wafer diameter. Selectable process allows up to four tapes per wafer.
Fine Tape Polish of “V” notch. Selectable process allows up to three tapes per wafer.
Grind and Polish of Symmetrical as well as Asymmetrical edge profiles.
Fine Tape Polish process dramatically reducing roughness and depth of damage maintaining the ground edge shape.
Non-contact pre/post process measurement of diameter and notch depth with programmable reject criteria.
Processed wafers oriented in cassette
3 Cassette Stations: can accept either 13 or 25 slot 300mm wafer, or 25 slot 200mm wafer standard cassettes.
Double sided rinse and spin-drying of processed wafers.
Closed loop servomotors on all motor driven axes provide a precise positioning.
Automated wafers Clean-Up in case of Aborted cycle
Advanced error handling w/ log file
Process and Pre/Post Measurement database and reports in tables and graphs can be exported in Excel or Text format
Windows type security system w/ up to 10 access levels, where each level has customized GUI
SECS/GEM communication.
Windows 2000 OS and SEMI compliant software
User-friendly operator interface w/ touch screen display.
Reasonable Footprint.
CE compliant