Polish Grinders

Polish Grinder is inspired by ACCRETECH's own innovative engineering, this Polish Grinder offers an integrated solution for thinner wafer and damage removal required for various IC cards, system-in-package products, and 3D mounting technology. This system removes damages made on the back of wafer by Back Grinder and creates high quality thin wafers.

Polish Grinder: PG300/PG200

The product of a unique ACCRETECH innovation, this Polish Grinder combines the wafer thinness required for IC cards and three-dimensional mounting technology with damage removal functions in a single device.
PG200
PG200		 PG200

Feature 1:
Performs the processes of the rough grinding, fine grinding, polishing and cleaning wafers on the both sides in a single machine.
Feature 2:
All the processes are completed without moving the wafer on the same chuck table.
Feature 3:
The smallest footprint in the world
Feature4:
Environmental - friendly - subsurface damage reduction without chemicals.
Feature 5:
System configuration
PG200
 


Polish Grinder: PG300RM/PG200RM

ACCRETECH also offers the "RM option", having the additional process of the tape removing for thinner wafer after the tape mounting, in addition to the standard process of PG300/200.
Polish Grinder: PG300RM/PG200RM
PG300 RM : For 300mm Wafers

PG200 RM : For 200mm Wafers

Feature 1: Optional RM module
The RM200/300 offers a single-unit solution supplementing PG200/300 processing with additional functionality to remove protective tape from thinner wafers and apply wafers to dicing frames.
Feature 2:
Performs the processes of the rough grinding, fine grinding, polishing and cleaning wafers on the both sides in a single machine.
Feature 3:
All the processes are completed without moving the wafer on the same chuck table.
Feature 4:
The smallest footprint in the world.
Feature 5:
Environmental - friendly - subsurface damage reduction without chemicals.
Feature 6:
System configuration
PG300RM/PG200RM
 


Back Grinders:BG200

Back Grinder packs various technologies together enabling high productivity and reliability in a compact body.

Feature 1:
ACCRETECH has accumulated grinding technology through the production of wafer slicing machines and wafer edge grinding machines, and measuring technology through the production of in-process gauges. Combining these technologies with a user-friendly interface, ACCRETECH offers a high precision, high stability wafer grinder.
 Back Glinders:BG200

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