MEP – 2500, 4600, 5800

Features and Benefits

Wafer Diameter from 50 mm to 200 mm
Round, Notched, or Flatted wafers
Rough and Fine Groove Grinding
Symmetrical and Asymmetrical Edge Profile
Non-contact pre- and post-grind measurement
Precise centering on grind chuck
Conventional or Non Conventional grinding
Processed wafers oriented in cassette
4 Cassette loading/unloading station
Automated wafers Clean-Up in case of Aborted cycle
Advanced error handling w/ log file
Process and Pre/Post Measurement database and reports in tables or graphs can be exported in Excel or Text format
Windows type security system w/ up to 10 access levels, where each level has customized GUI access
SECS/GEM communication.
Windows NT OS
High throughput
Small footprint
CE compliant