Wafer Dicing Machines

Laser Dicer: MAHOHDICING MACHINE

The world's first dicing machine to cut silicon wafers utilizing a non-contact method without creating any damage to the wafer surface. This is the first laser dicer that focuses the laser to the inside section of the Si wafer. This selectively forms a modifying layer by irradiating the laser to the inside section of the Si wafer which causes the modifying layer to grow vertically creating die separation with no chipping. 		Laser Dicer: MAHOH DICING MACHINE
Feature 1:
Dices even thin, fragile, and easy-to-crack monocrystalline silicon wafers without causing physical stress.
Feature 2:
Throughput is improved dramatically due to the highspeed dicing a few times faster than the conventional machine.
Feature 3:
Complete dry process that requires no wash-up.
 Laser Dicer
Feature 4:
Comparison of chip surfaces MAHOHDICING
Comparison of chip surfaces MAHOHDICING
Wafer after expanding Magnified view
Wafer after expanding Magnified view
 

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