Wafer Probing Machines

Wafer Probing Machine is to test electric characteristics of each chip created on a wafer. The test is made by a probe of probe card, attached to a wafer prober and connected to tester, contacting to a pad of each chip of a wafer on the stage of wafer prober. By this testing, chips are sorted into good or defective chips.



Wafer Probing Machine: FP200A

Wafer Probing Machine: FP200A
Evolving and Proliferating Wafer Probing Machine, UF Series
Based on a flexible platform, the high accuracy and high rigidity, UF series is further evolved. Wafers are varying with the progress of line width shrinkage and assembly technology. This machine can be used for processing very thin wafers and can be used as a handler for the wafer level burn-in system.

Feature 1:
Frame transfer ready for the thinner wafer.
Frame transfer ready for the thinner wafer.