Ultra Edge – 200, 300

• Capable of grinding and (or) polishing 200 mm or 300 mm diameter wafers with a notch.
• Rough and fine grinding of wafer diameter using one multi grit grind wheel.
• Rough and fine grinding of “V” notch using two high-speed spindles.
• Fine Tape Polish of wafer diameter. Selectable process allows up to four tapes per wafer.
• Fine Tape Polish of “V” notch. Selectable process allows up to three tapes per wafer.
• Grind and Polish of Symmetrical as well as Asymmetrical edge profiles.
• Fine Tape Polish process dramatically reducing roughness and depth of damage maintaining the ground edge shape.
• Non-contact pre/post process measurement of diameter and notch depth with programmable reject criteria.
• Processed wafers oriented in cassette
• 3 Cassette Stations: can accept either 13 or 25 slot 300mm wafer, or 25 slot 200mm wafer standard cassettes.
• Double sided rinse and spin-drying of processed wafers.
• Closed loop servomotors on all motor driven axes provide a precise positioning.
• Automated wafers Clean-Up in case of Aborted cycle
• Advanced error handling w/ log file
• Process and Pre/Post Measurement database and reports in tables and graphs can be exported in Excel or Text format
• Windows type security system w/ up to 10 access levels, where each level has customized GUI
• SECS/GEM communication.
• Windows 2000 OS and SEMI compliant software
• User-friendly operator interface w/ touch screen display.
• Reasonable Footprint.
• CE compliant

MEP – 2500, 4600, 580