Crystal Edge

DELTAIR 22H

 

“Crystal Edge™”, Accretech’s new automated wafer edge inspection system, uses proprietary image acquisition and processing technologies to capture yield killer defects. It is specially designed to inspect defects in wafer edge regions: top near surface, top bevel, apex, bottom bevel and bottom near surface. Engineers and operators can also utilize Crystal Edge’s manual or automated review modes to visualize inspected defects.

Inspection Region:



Features:
Automated image acquisition
Automated defect classification and counting
Programmable inspection and review angle
Programmable inspection and review sensitivity
Wafer edge exclusion measurement


Defect Classification:
(1) Bright defects (2) Dark defects
(3) Light point defects (4) Large area defects
(5) Scratches (6) chips

Image Acquisition:


Programmable Angle:

 

Wafer Edge Exclusion Measurement:

 

Wafer Edge Processing:

Elimination and prevention of wafer edge defects is possible with Accretech’s Habanero.


Quicklink