CMP

CMP is one of planarizing technologies for the surface of wafer during IC fabrication. Using chemical abraisive and polishing pad, uneven surface of wafer is planarized by combination of chemical process and mechanical polishing. At present, there are two usages for the system; the insulating film field (planarizing inter layer dielectric and creating insulating film with STI buried) and metal field (W plug formation and Cu damacine process).

ChaMP: For 300mm Wafers

Combining the technological expertise built up by Accretech in precision measuring equipment and semiconductor manufacturing equipment, we now offer "the ChaMP Series", the CMP systems compatible with 300 mm wafers, with process performance required by design rules for 90 nm and 65 nm devices, and able to keep up with the most advanced volume-production fabs.
Feature 1:
Air-float Head "Sylphide"
·Reference polishing is made possible via an air cushion that provides uniform pressure distribution. ·Wafer pressure is applied by an airbag independent of ring pressure, providing excellent low-pressure controllability and stability. ·Zone control is available.
Air-float Head Sylphide
Feature 2:
Edge Exclusion of 1 mm!
Edge Exclusion of 1 mm!
Feature 3:
Wafer Pressure Controllability & Repeatability
Wafer Pressure Controllability & Repeatability
Feature 4:
Optimal System Configurations Match to Your Needs
ChaMP332(3 platen, 2 head configuration)
- This model is perfectly suits to multi-step processes, of Copper Application.
- Ideal throughput can be achieved with minimum risk of copper corrosion.?
 ChaMP332
ChaMP333(3 platen, 3 head configuration)
- This model is perfectly suited to single-step processes for extended polishing time.
- Perfectly suits to multiple applications.
- Excellent throughput is achieved with multi-step processes conducted within identical platen.
 ChaMP333
ChaMP322(2 platen, 2 head configuration)
- This model is perfectly suited to single-step processes for short polishing time.
- Compact in size, with a footprint of 9.0 m2.
 ChaMP322
Feature 5:
EFEM Configuration for Higher Productivity
The New EFEM configuration of the ChaMP3** Series provides 4 FOUP Openers (maximum). In addition, a dry in-line film thickness measuring tool and NPW stock cassette are available.
EFEM Configuration for Higher Productivity
Feature 6:
Optical End-Point Detection System
- ILD Process Spectrum Signal (Patterned Wafer)
ILD Process Spectrum SignalILD Process Spectrum Signal
Feature 7:
Simple Maintenance for Polishing Heads - Ring Change
Demounting (approximately 5 seconds)
SiC NIST specification Si 8inch specification Si 6025 specification
Slide the snap ring cover up with both hands Spread the snap ring with your thumb (the retaining ring drops off) Completely remove the retaining ring

Mounting (approximately 10 seconds)
- Grip the snap ring with both hands and push the retainer into the carrier. Rotate it slightly to align the faces where the positioning frame slips into place.
- Attach the snap ring round the whole circumference and slide the cover down.
 


ChaMP: For 150 or 200mm Wafers

For 150 or 200mm Wafers

 For 150 or 200mm Wafers

Quicklink

More Products