Wafer Probing Machines

Wafer Probing Machine is to test electric characteristics of each chip created on a wafer. The test is made by a probe of probe card, attached to a wafer prober and connected to tester, contacting to a pad of each chip of a wafer on the stage of wafer prober. By this testing, chips are sorted into good or defective chips.

Wafer Probing Machines: UF3000EX

Next-generation high-spec probing machine the world No.1 supplier presents

Phenomenal levels of throughput have been made possible with the synergistic effects of high-speed wafer handling enabled by a new algorithm, and the high-speed and low-noise XY Stage enabled by a newly developed purpose-built drive unit for probes. The Z axis ensures world-class load capacity and high precision, and offers excellent contact via an optimal structural design that employs topology which reliably eliminates changes in flatness due to positioning.

With advanced OTS latest positioning system technology and by colorizing wafer alignment imaging and equipping a light super magnification function, the UF3000EX has improved dramatically in terms of precision and operability.

Wafer Probing Machines: UF3000

Next-generation high-spec probing machine UF3000 the world No.1 supplier presents
Assimilating the up-to-date technologies such as originative OTS, QPU and TTG, this super high-spec system provides the testing system which meets your needs for the miniaturization of the next-generation devices and various testing environment.
Feature 1: OTS - the newest positioning technology (Optical Target Scope)
OTS enables to measure the relative position of the cameras with absolute accuracy, which improved dramatically. Based on the ACCRETECH metrology technology, OTS enables the self-correlation of the alignment optical system.
 OTS - the newest positioning technology
Feature 2: QPU - super high-rigid chucking (Quad-Pod Unit)
To effectively attain the accuracy in positioning, the high rigidity of every part is greatly important. The UF3000 uses the new technology of 4 axes driving mechanism (QPU) for Z-axis, enabling the high-rigid, stable probe contact.
QPU - super high-rigid chucking (Quad-Pod Unit)
Feature 3: Load-port
Testing environment satisfying the users' needs is available by the common platform of 8-inch and 12-inch cassettes and the front allocation of the inspection tray. The machine is also ready for AMHS (Automated Material Handling System).

Load-portLoad-port
Feature 4: TTG (Touch To Go)
Pursuing the easy operation, the UF3000 adopts the function to move to the position you touch on the map or image shown on the touch panel. Setting up is easy, and screen configuration is possible by the user definition.

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