Wafer Probing Machines

Wafer Probing Machine is to test electric characteristics of each chip created on a wafer. The test is made by a probe of probe card, attached to a wafer prober and connected to tester, contacting to a pad of each chip of a wafer on the stage of wafer prober. By this testing, chips are sorted into good or defective chips.

Wafer Probing Machine: UF2000

 Wafer Probing Machine: UF2000
Tokyo Seimitsu, now known as Accretech, has continued to lead the semiconductor industry as the world's number one manufacturer of wafer probing machines. The newly developed UF2000 high-precision 200mm wafer prober is designed for devices with decreasing pad pitches typified by LCD drivers and other such devices, and features enhanced functionality in all areas, while offering the same functions and operating ease as the previous model.

Feature 1:
Achieves overall precision of ±1.5µm.
Feature 2:
Adopts new processor, newly designed loader and image processing system with enhanced performance, dramatically boosting throughput.
 


Wafer Probing Machine: UF200SA

 Wafer Probing Machine: UF200SA
Evolving and Proliferating Wafer Probing Machine, UF Series
Based on a flexible platform, the high accuracy and high rigidity, UF series is further evolved. Wafers are varying with the progress of line width shrinkage and assembly technology. This machine can be used for processing very thin wafers and can be used as a handler for the wafer level burn-in system.

Feature 1:
8-inch multipurpose machine.
 


Wafer Probing Machine: UF200A

 Wafer Probing Machine: UF200A
Evolving and Proliferating Wafer Probing Machine, UF Series
Based on a flexible platform, the high accuracy and high rigidity, UF series is further evolved. Wafers are varying with the progress of line width shrinkage and assembly technology. This machine can be used for processing very thin wafers and can be used as a handler for the wafer level burn-in system.

Feature 1:
8-inch multipurpose machine.
 


Wafer Probing Machine: UF190B

 Wafer Probing Machine: UF190B
Evolving and Proliferating Wafer Probing Machine, UF Series
Based on a flexible platform, the high accuracy and high rigidity, UF series is further evolved. Wafers are varying with the progress of line width shrinkage and assembly technology. This machine can be used for processing very thin wafers and can be used as a handler for the wafer level burn-in system.

Feature 1:
High-performance, high-throughput, and excellent cost performance machine.
Feature 2:
The UF190A features the same high-performance and excellent operability as the UF200 earned a reputation including the automatic needle alignment function and the color LCD touch panel.
 


Wafer Probing Machine: FP200A

 Wafer Probing Machine: FP200A
Evolving and Proliferating Wafer Probing Machine, UF Series
Based on a flexible platform, the high accuracy and high rigidity, UF series is further evolved. Wafers are varying with the progress of line width shrinkage and assembly technology. This machine can be used for processing very thin wafers and can be used as a handler for the wafer level burn-in system.

Feature 1:
Frame transfer ready for the thinner wafer.
Frame transfer ready for the thinner wafer.
 

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