Wafer Manufacturing
ACCRETECH-TOKYO SEIMITSU is primarily engaged in the sale of: equipment such as wafer slicing machines that cut silicon crystal ingots into silicon substrates called wafers, upon which semiconductor processing is conducted; and, wafer edge grinding machines that chamfer the edges of the wafers.Front-end
More than 70% of semiconductor manufacturers' investment is poured into front-end, or wafer processing, which is essential in semiconductor production. Our CMPs planarize the wafer surface.Wafer Test
In wafer testing, our probing machines provide 100% inspection of the electrical characteristics of the various devices on the wafer.Back-end
Back-end processing refers to assembly and final testing. For use in the back grinding process to polish the backside of the wafer, ACCRETECH-TOKYO SEIMITSU manufactures and sells polish grinders that combine globally unrivalled wafer thinness and damage removal functions in a single device. We are also engaged in the manufacture and sale of wafer dicing machines to cut wafers with microscopic circuit patterns into individual chips.