Wafer Manufacturing
ACCRETECH-TOKYO SEIMITSU is primarily engaged in the sale of: equipment such as wafer slicing machines that cut silicon crystal ingots into silicon substrates called wafers, upon which semiconductor processing is conducted; and, wafer edge grinding machines that chamfer the edges of the wafers.Front-end
More than 70% of semiconductor manufacturers' investment is poured into front-end, or wafer processing, which is essential in semiconductor production. Our wafer inspection systems check for foreign matter or pattern defects on the surface of the wafer with the imprinted circuit pattern, while our CMPs planarize the wafer surface.Wafer Test
In wafer testing, our probing machines provide 100% inspection of the electrical characteristics of the various devices on the wafer.Back-end
Back-end processing refers to assembly and final testing. For use in the back grinding process to polish the backside of the wafer, ACCRETECH-TOKYO SEIMITSU manufactures and sells polish grinders that combine globally unrivalled wafer thinness and damage removal functions in a single device. We are also engaged in the manufacture and sale of wafer dicing machines to cut wafers with microscopic circuit patterns into individual chips.