Dedicated High Precision Wafer Thickness Measuring System

Wafer Thickness Measuring System

Dedicated High Precision Wafer Thickness Measuring System

Features1:
For various wafer sizes: Models are available to measure the thickness of f3, f4, f5, f6 and f12 wafers.
Features2:
Easy to operate: changes between different wafer sizes can be performed by simply changing the position of the stopper pin.
Features3:
Moire Scale Provides 0.1 µm Min. Resolution, repeatability of 0.2 µm and a highly precise cumulative indication error of ±0.15 µm
Features4:
The lift lever incorporates a printout command switch. This enables data to be printed as soon as measurement has been completed.