Habanero

Accretech’s new bevel etcher

“Habanero™”, Accretech’s new bevel etcher, uses FACE™ (Flame Assisted Chemical Etch) technology to remove wafer edge films before delamination. Accretech’s patented technology directs reactive gas to precisely controlled edge regions while simultaneously shielding active device areas from exposure to reaction products. Habanero’s FACE™ process requires no masking or post-process cleaning. It replaces conventional and expensive wet chemistries, abrasive pads, brushes or tapes, and eliminates ion-assisted processes that can induce charge damage.